Design verification is a prerequisite for all assemblies
provided. It is fundamental to ensuring every assembly
meets its defined design requirements. There is flexibility
in the way in which this is achieved within the new standard,
and some new concepts have been introduced, but the
options are defined and where necessary their use is
restricted and a design margin applied.
Examples of the limitations and margins applied to verification without type test include;
All assemblies connected to a supply with a prospective short circuit current in excess of 10kA
rms or having a cut-off current of 17kA peak must be of a type-tested design or the verification
must be an interpolation from a reference design. Under no circumstances can the assigned
short circuit current rating be higher than that of the reference design.
So as to take account of the air temperature within the enclosure, thermal interactions and
possible hot spots; components within a circuit that has not been temperature rise tested,
must be de-rated to 80% of their free air current rating.
Comparison of the power loss of the components within an assembly with the known heat
dissipation capability of an enclosure, is restricted to assemblies having a rating of 630A.
Confirmation of temperature rise performance by calculation is limited to assemblies with a
rating not exceeding 1600A. Test or interpolation from a tested design must be used to verify
higher ratings.
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